QBT-MPCMulti-target Ultra-high Vacuum Magnetron Co-Sputtering System
Product Overview
QBT-MPC includes two ultra-high vacuum chambers Load lock and Sputtering, equipped with a fully automatic operation. The system is equipped with multiple magnetron cathodes with in-situ tilting for co-sputtering process. QBT-MPC is the state-of-the-art sputtering system of material platform, such as spintronics, topological materials, superconducting materials, etc.
Technical Advantages
Process Chamber Ultimate Pressure：≤3E-9 Torr
Process Temperature：0-1000°C（none oxygen atmosphere）
Sample Size：Max 12 inch Wafer and smaller chips compatible
Uniformity：<±3% (8 inch wafer with 5 mm removal from the edge)
Power Supply: 2*1kW DC power (Optional RF, customized request)
Magnetron cathodes：Up to 12 × 2 inch cathodes, 5 × 4 inch cathodes, 7 × 3 inch cathodes (Upon request)
