MINI R&D Desktop ALD

Yunmao Product Overview

MINI is a mini easy-to-use desktop ALD system, which can realize controllable atomic layer deposition on 4-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.

Yunmao Technical Advantages

Weight: 70kg

Dimension(L x W x H): 550 x 470 x 470 (mm)

Power Supply: 220VAC 50HZ Rating: 1.5kW/7A, Peak power: 2.2kW/10A

Sample Size: Max 6 inch wafer and smaller chips compatible；Sample height≤3mm

Ultimate Pressure: ≤50 mTorr

Process Temperature: RT-360℃

Precursor Temperature: Up to 180℃

Products category

For Industry

ALD

Plasma Batch ALD

PBATCH Batch PEALD

Thermal Batch ALD

CBATCH 100s Batch Thermal ALD CBATCH 300s Batch Thermal ALD

CVD

MPCVD Diamond CVD

Epitaxy

SICE-Y8 SiC Epitaxy CVD System

Powder ALD/CVD

KG Powder ALD for Mass Production

SCA Powder CVD for Mass Production

For R&D

ALD

Single Wafer ALD

QBT-A
High Vacuum Plasma-enhanced ALD System MINI R&D Desktop ALD

Sputter

Single-Cathode Vertical Sputtering

QBT-P
Dual-chamber Ultra-high Vacuum Magnetron Sputtering System PVD-100
Dual-chamber High Vacuum Magnetron Sputtering System QBT-P L3
Triple-chamber Ultra-high Vacuum Magnetron Sputtering System(α-Ta、Nb-Ta)

Multi-Cathode Vertical Sputtering

QBT-MPV
Multi-target Ultra-high Vacuum Magnetron Vertical Sputtering System

Multi-Cathode Co-Sputtering

QBT-MPC
Multi-target Ultra-high Vacuum Magnetron Co-Sputtering System

MP L Customized Series

QBT-MP·L3
Multi-chamber Ultra-high Vacuum Magnetron Sputtering System

Evaporator

QBT-I Dual-chamber High-speed Evaporator

QBT-J Four-chamber Ultra-high Vacuum GLAD System

QBT-E Dual-chamber Ultra-high Vacuum Electron Beam Evaporator

Powder ALD

GM R&D Powder ALD

QBT-T Dual-chamber Plasma-enhanced Wafer and Powder ALD System

产品视频

Application

Energy Material

Nanomaterial

Semiconductor

Sensor

FAQ

What are features and highlights of MINI？

It features a high level of integration, with only the size of an oven, making it compact and space-saving. It supports a wide range of processes and can fabricate materials such as HfO₂, ZnO, Al₂O₃, and TiO₂.

What is the maximum wafer size that MINI can produce？

MINI is a monolithic (single-wafer) research equipment capable of accommodating standard 6-inch wafers at maximum, and can also process small quantities of powdered samples (3g).

What are the applications of MINI?

Semiconductor field: High-K dielectrics, supercapacitors, diodes, etc.; Nanocatalyst field: Photocatalysis, electrochemical catalysis; Perovskite solar cells.

Related products

QBT-A High Vacuum Plasma-enhanced ALD System

The QBT-A system is specially designed for low oxygen containment thin film deposition applications, especially suitable for TiN deposition, such as ultra-low loss RF circuits, TSV filling processes. The unique design minimizes the oxygen content in the process chamber.

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QBT-P Dual-chamber Ultra-high Vacuum Magnetron Sputtering System

QBT-MP·L3 Multi-chamber Ultra-high Vacuum Magnetron Sputtering System

CBATCH 100s Batch Thermal ALD

GM R&D Powder ALD

PVD-100 Dual-chamber High Vacuum Magnetron Sputtering System

QBT-P L3 Triple-chamber Ultra-high Vacuum Magnetron Sputtering System(α-Ta、Nb-Ta)

QBT-MPV Multi-target Ultra-high Vacuum Magnetron Vertical Sputtering System

QBT-MPC Multi-target Ultra-high Vacuum Magnetron Co-Sputtering System