QBT-P Dual-chamber Ultra-high Vacuum Magnetron Sputtering System

QBT-P enables high-quality thin-film deposition and can grow high-purity α-phase tantalum films at both high and room temperatures. It deposited α-Ta films exhibit superior superconducting properties with Tc > 4.25 K and residual resistance ratio > 6, enabling low-loss quantum circuits that achieve single-photon Q > 10⁶ and qubit coherence times exceeding 250 μs.

PVD-100 Dual-chamber High Vacuum Magnetron Sputtering System

PVD-100 includes two ultra-high vacuum chambers Load Lock and Sputtering, equipped with a fully automatic operation interface. RF power supplies are compatible with metallic or non-metallic materials.

QBT-P L3 Triple-chamber Ultra-high Vacuum Magnetron Sputtering System(α-Ta、Nb-Ta)

QBT-P L3 includes three process chambers. Compared to QBT-P, one more sputtering chamber is included enabling multi-layer structures, such as Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions. The system is also compatible with seed layer based process.

QBT-MPV Multi-target Ultra-high Vacuum Magnetron Vertical Sputtering System

QBT-MPV is an upgraded system from QBT-P. Compared to QBT-P, QBT-MPV includes up to 4 magnetron cathodes (upon request) in one sputtering chamber, enabling multi-layer process, such as Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions. The system is also compatible with seed layer based process.

QBT-MPC Multi-target Ultra-high Vacuum Magnetron Co-Sputtering System

QBT-MPC includes two ultra-high vacuum chambers Load lock and Sputtering, equipped with a fully automatic operation. The system is equipped with multiple magnetron cathodes with in-situ tilting for co-sputtering process. QBT-MPC is the state-of-the-art sputtering system of material platform, such as spintronics, topological materials, superconducting materials, etc.

QBT-MP·L3 Multi-chamber Ultra-high Vacuum Magnetron Sputtering System

Fabrication of superconducting Ta/TiN/NbN/Al/Nb